UFS 3.0

Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interface, thus providing high performance memory for mainstream handsets in a cost-effective form-factor. Samsung’s UFS-based multichip packages (uMCPs) integrate 10 GB or 12 GB of LPDDR4X-4266 memory (made using the company’s 2nd Generation 10nm-class process technology) as well as NAND flash storage featuring a UFS 3.0 interface. Since both new uMCP modules incorporate four DRAM devices, they will allow the latest SoCs with quad-channel LPDDR4X memory controllers to reach up to 34.1 GB/s memory bandwidth. Meanwhile on the NAND side of matters...

Samsung's New 512 GB UFS 3.0 Chip for Galaxy Fold, Now in Mass Production

Samsung this week said that it has begun mass production of its UFS 3.0 chips. The company’s initial lineup of UFS 3.0 products includes embedded drives featuring a 128...

6 by Anton Shilov on 2/27/2019

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