TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that...
3 by Anton Shilov on 7/25/2023
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...
5 by Anton Shilov on 7/24/2023
AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics
Over the weekend, AMD officially listed the Ryzen 5 7500F processor on their website. Although initial reports pointed towards a China-only release, and at present, that much is true...
9 by Gavin Bonshor on 7/24/2023
TSMC: 3nm Chips for Smartphones and HPCs Coming This Year
While TSMC formally started mass production of chips on its N3 (3nm-class) process technology late last year, the company is set to finally ship the first revenue wafers in...
21 by Anton Shilov on 7/21/2023
Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs
This week the Linux Foundation has announced that the group will be overseeing the formation of a new Ethernet consortium, with a focus on adapting and refining the technology...
7 by Anton Shilov on 7/21/2023
Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI
Cerebras Systems and G42, a tech holding group, have unveiled their Condor Galaxy project, a network of nine interlinked supercomputers for AI model training with aggregated performance of 36...
1 by Anton Shilov on 7/21/2023
Solidigm Announces D5-P5336: 64 TB-Class Data Center SSD Sets NVMe Capacity Records
Advancements in flash technology have come as a boon to data centers. Increasing layer counts coupled with better vendor confidence in triple-level (TLC) and quad-level cells (QLC) have contributed...
18 by Ganesh T S on 7/20/2023
TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers
TSMC on Thursday disclosed that it will have to delay mass production at its Fab 21 in Arizona to 2025, as a lack of suitably skilled workers is slowing...
27 by Anton Shilov on 7/20/2023
ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business
ASUS and Intel late on Tuesday announced that they had agreed to a term sheet involving Intel's NUC business, ensuring the continued support of existing NUC hardware as well...
6 by Ganesh T S & Anton Shilov on 7/19/2023
Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin
Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been...
11 by Ryan Smith on 7/18/2023
Logitech Acquires Loupedeck to Enhance Its Software Roadmap
Being a significant maker of peripherals in general and gaming peripherals in particular, Logitech cannot omit the content creators and streamers market, which is now virtually dominated by Corsair's...
6 by Anton Shilov on 7/18/2023
Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report
Currently, only two foundries offer their customers 3 nm and 4 nm-class process technologies: TSMC and Samsung Foundry. But business media sometimes blames Samsung Foundry for mediocre yields on...
5 by Anton Shilov on 7/18/2023
Lenovo Develops Mini-ITX Form-Factor GeForce RTX 4060
One of design perks of NVIDIA's GeForce RTX 4060 is its relatively low power consumption, which has allowed graphics cards makers to produce compact add-in-boards without the massive heatsink...
19 by Anton Shilov on 7/17/2023
Corsair to Enter Personalized Peripherals Market with Drop Acquisition
Corsair on Monday said that it had agreed to buy Drop, a leading maker of personalized peripherals, such as keyboards. The market for bespoke hardware is growing these days...
4 by Anton Shilov on 7/17/2023
Intel Foundry Services Readies Intel 16 Process: Low Power FinFET For Everyday Chips
Intel Foundry Services (IFS) this week soft-launched their new Intel 16 process technology, a 16nm-class node that will be used for the production of low-power chips for everyday workloads...
3 by Anton Shilov on 7/14/2023
ASRock Announces Taichi Lite Motherboards: Same Specs, Less RGB
Last month at Computex, ASRock unveiled two new Taichi-inspired motherboards based on a 'lite' approach to aesthetics and design, which they called Taichi Lite. Today, ASRock has officially announced...
11 by Gavin Bonshor on 7/13/2023
AMD Quietly Introduces Ryzen 3 5100 Quad-Core Processor For AM4
Further to AMD's latest Micro Center exclusive processor, the Ryzen 5 5600X3D with 3D V-Cache, AMD has seemingly introduced a budget-focused quad-core processor based on their Zen 3 architecture...
13 by Gavin Bonshor on 7/12/2023
Intel Set to Exit NUC PC Business - Pushes Partners to Develop More SFF PCs
Intel has disclosed today that it will halt further development of its small form factor Next Unit of Compute (NUC) PCs. The tech giant expects its partners to take...
39 by Anton Shilov on 7/11/2023
El Capitan's Little Brother Tuolumne Can Conquer Most Top 10 Supercomputers
Lawrence Livermore National Laboratory (LLNL) started to install its El Capitan supercomputer that promises to achieve computational performance of over 2 FP64 ExaFLOPS for classified national security research. Parallel...
3 by Anton Shilov on 7/11/2023
Adata Reveals Its First PCIe Gen5 SSD: Legend 970
Adata has introduced its first PCIe 5.0 SSD, the Legend 970. A Phison E26-based design, the Legend 970 pairs Phison's high-end controller with a sophisticated active cooling system that...
26 by Anton Shilov on 7/6/2023
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